Lead integrity/micro torsion

Workholder micro torsion

Lead integrity/micro torsion Our lead integrity test method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals. There are 4 different test conditions which […]

Deep access

Deep access alignment

Deep access When parts of the sample obstruct optical access from microscope to test point, special deep access tooling and flexible cameras enable testing of complex sample architectures. The standard […]


Board bend

Fatigue There are a few basic types of fatigue test. The sample can be subjected to repeated shear, pull or push loads. In the case of shear these can also […]


Creep test Sigma

Creep The ever increasing complexity of modern circuit boards makes it ever more important to test the reliability at every stage of production. In response to this and working with […]


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