Why test bonds? Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly..
Wire pull Wire Pull Testing applies an upward force under the wire, effectively pulling it away from the substrate. There are many types of pull tests, therefore xyztec..
Why test bonds? Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly..
Wire pull Wire Pull Testing applies an upward force under the wire, effectively pulling it away from the substrate. There are many types of pull tests, therefore xyztec..