InterBattery Korea 2020
InterBattery 2020, first launched in 2013 in Seoul, Korea, is Korea’s leading battery exhibition showcasing various new products and technologies related to battery industry. Running concurrently as a part of […]
10 events found.
Events
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Coex Hall A
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Nepcon Nagoya 2020
Portmesse NagoyaNagoya edition of NEPCON JAPAN, Asia's leading trade show for electronics R&D and manufacturing technologies with 750* exhibitors and 45,000* visitors! Nagoya is a capital city of Aichi prefecture which […]
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SEDEX Korea 2020
COEX Hall C&D(3F)The Semiconductor Exhibition will be held at COEX from October 28 to 30, 2020. It is among one of the most outstanding exhibitions that covers the full spectrum of the […]
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MWE 2020
Pacifico YokohamaMore than 400 microwave-related companies from all over the world will exhibit their latest products. Some sessions of the Microwave Workshops and the Technical Seminars by Exhibitors will be held […]
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Semicon China 2021
Shanghai New International Expo Centre 2345 Longyang Rd, Shi Ji Gong Yuan,, Shanghai, Pudong, China -
Productronica China 2021
Shanghai New International Expo Centre 2345 Longyang Rd, Shi Ji Gong Yuan,, Shanghai, Pudong, ChinaRaysun: Hall E3, booth 3500
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ExpoElectronica 2021
Crocus Expo IEC Mezhdunarodnaya Ulitsa, 1, Moscow Oblast, Krasnogorsk, Russian Federation -
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Productronica 2021
Messe München Am Messeturm, München, GermanyVisit us at Budatec booth A1.347 World’s Leading Trade Fair for Electronics Development and Production Being the world's leading trade fair for electronics development and production, productronica has many new […]
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Semicon Taiwan 2021
TaiNEX 1 No. 1, Jingmao 2nd Road, Taipei City, Nangang District, TaiwanKingyoup M1148 SST K2270
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IMAPS Device Packaging Conference 2022
WeKoPa Resort and Conference Center 10438 N Fort McDowell Rd, Scottsdale, United StatesThe 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society […]
