News

News

Successful seminar at Tianjin University on Packaging High-temperature Electronics

Successful seminar at Tianjin University on Packaging High-temperature Electronics

Seminar together with Tianjin University

Xyztec looks back on a very successful seminar together with Tianjin University on “Challenges and Opportunities in Packaging High-temperature Electronics”.

Challenges and Opportunities in Packaging High-temperature Electronics

This conference was visited by more than 80 people from leading companies in China, sharing knowledge. On behalf of co-host xyztec, Dirk Schade presented information about the latest possibilities in high force IGBT application testing.

Different users from different countries met and were excited to discuss new manufacturing and testing techniques. Among the other speakers on the event were Professor Guo-quan Lu from Tianjin University and representatives from Orthodyne Electronics.

The Sinter technology and Cu wire bonding attracted a lot of attention. The visitors of the seminar used the breaks between the various sessions for sharing experience.

 

Tianjin_University_Seminar_XYZTEC_3_small Tianjin_University_Seminar_XYZTEC_1_small

Seminar together with Tianjin University

Contact Us

Tom Haley


    WP Feedback

    Dive straight into the feedback!
    Login below and you can start commenting using your own user instantly

    We strive to offer our content in as many languages as possible, among which are:
    • English
    • Deutsch (German)
    • 简中 (Simplified Chinese)
    • 繁中 (Traditional Chinese)
    • 日本 (Japanese)
    • 한국어 (Korean)
    • русский (Russian)

    If a page is not available in your language, we automatically show the default English page. Your browser is set to ENGLISH. Check your browser settings if you wish to access our website in a different language.