Xyztec showcased its cutting-edge solutions and expertise at the prestigious Electronic Components and Technology Conference (ECTC) held last week in Orlando. Our presence at the event was successful and garnered […]
Xyztec was promoting the most advanced Sigma bond tester on 4 and 5 November at the Vehicle Rank Power Semiconductor annual conference in Baidu. It was a successful seminar with […]
Also this year, Xyztec was a participant at the yearly China Semiconductor Packaging and Test Technology & Market Conference 2018 to present the latest developments in automatic bond testing.
The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. Xyztec, the technology leader in bond testing, was present to […]