How to Cold Bump Pull (CBP)?
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. The Cold Bump Pull (CBP) test method is the ultimate solution for solder ball […]
It’s all about accuracy
To provide end-users with an increasingly better product that is also reliable, bond test equipment requires accuracy in the micron range. The technology evolves, and assembly methods of bonding processes […]
More on loop height testing
Loop height measurement Did you know you can use the Sigma for measuring the wire loop height on your samples? Sigma bond testers have been doing loop height tests for years, but the […]
