New uni-axial bending test for ultra-thin die

Bending tool

Ultra-thin die with reduced layer thickness enable the high mechanical flexibility required for many new applications. This however increases the demand for manufacturing and testing. The standard shear test can […]

Busy first show for Tom Haley

Semicon West 2012

The past week, xyztec was exhibiting in the Moscone Center in San Francisco at Semicon West 2012. The Sigma with its automation features was the center of attention. Also, xyztec […]