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The xyztec Solder Ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress free using the standard EZ controls. Precise shear height control and force measurement ensure accurate data with minimum distribution. Password protected flexibility of the programmable test parameters allow you to be in control.
An optional camera system is available for visually inspecting the test result. Xyztec complies with all relevant international standards such as ASTM, MIL.
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
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