SMTconnect 2019 May 7-9, 2019 in Nuremberg - Hall 4A, Booth 147 The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with..
Last week, IMAPS-UK celebrated 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS at the Royal Holloway University of London. (more…)
Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT)
Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on "Recent and Future Advances in Bond Testing" at China Semiconductor Packaging Test..
SMTconnect 2019 May 7-9, 2019 in Nuremberg - Hall 4A, Booth 147 The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with..
Last week, IMAPS-UK celebrated 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS at the Royal Holloway University of London. (more…)
Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT)
Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on "Recent and Future Advances in Bond Testing" at China Semiconductor Packaging Test..