SMTconnect 2019 May 7-9, 2019 in Nuremberg – Hall 4A, Booth 147 The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with the new […]
Last week, IMAPS-UK celebrated 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS at the Royal Holloway University of London.
For the second year in a row, xyztec CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT).
Last week xyztec distributor for the Russian Federation, Sovtest ATE, held a seminar at their head office in the city of Kursk.
Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on “Recent and Future Advances in Bond Testing” at China Semiconductor Packaging Test Symposium (CSPT) […]
We are excited to announce that on the 9th of March 2009 Bob Sykes joined xyztec.