Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components and their […]
Cell phone display and LCD driver IC’s are difficult to shear test. A fundamental problem exists when shear testing large die; the strength of the bond (typically over 100 kgf) […]
Local support and parts, global presence, world-class testers
Netherlands
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Germany
Am Haupttor / Bürocenter
06237
Leuna
Germany
USA
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
Asia Pacific
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
Taiwan
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
Suzhou
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan,
Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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