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xyztec bv

Self aligning shear tool 6

Self-aligning shear tool

Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
LCD sample clamped

Cellphone display LCD driver IC testing

Cell phone display and LCD driver IC's are difficult to shear test. A fundamental problem exists when shear testing large die; the strength of the bond (typically over..

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Self aligning shear tool 6

Self-aligning shear tool

Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
LCD sample clamped

Cellphone display LCD driver IC testing

Cell phone display and LCD driver IC's are difficult to shear test. A fundamental problem exists when shear testing large die; the strength of the bond (typically over..
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