Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
Cell phone display and LCD driver IC's are difficult to shear test. A fundamental problem exists when shear testing large die; the strength of the bond (typically over..
Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
Cell phone display and LCD driver IC's are difficult to shear test. A fundamental problem exists when shear testing large die; the strength of the bond (typically over..