As the forerunner in automatic bond testing, xyztec comes with very promising functionalities to grade failure modes without any assistance for ball shear and wire pull tests. Read more about […]
We have not been sitting still at Xyztec this year. We are always developing innovative solutions on customer demand. In 2019 we supplied an important customer with multiple Sigma MAG […]
SMTconnect 2019 May 7-9, 2019 in Nuremberg – Hall 4A, Booth 147 The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with the new […]
Xyztec is at SMT Hybrid Packaging Nuremberg this week from June 5th until June 7th at the Nürnberg Messe in Germany. Europe’s leading event for system integration in microelectronics.