Successful ESTC Conference in Dresden, Germany

ESTC 2018 Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. Xyztec, the technology leader in bond testing, was present to […]

LEGO® for Nepal sponsored by xyztec

Lego for Nepal

De eerste uitwisseling in april 2018 van het project “LEGO® voor Nepal” gesponsord door xyztec was een geweldige ervaring met een nog groter resultaat.

Visit us at SMT Hybrid Packaging Nuremberg

SMT Hybrid Packaging Nuremberg

Xyztec is at SMT Hybrid Packaging Nuremberg this week from June 5th until June 7th at the Nürnberg Messe in Germany. Europe’s leading event for system integration in microelectronics.

xyztec workshop at IMAPS UK

Workshop IMAPS UK

Last week, IMAPS-UK celebrated 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS at the Royal Holloway University of London.

ODEOM shows Sigma in Istanbul

ODEOM and xyztec at WIN Eurasia 2018

Currently, our Turkish distributor ODEOM is exhibiting the xyztec Sigma at WIN Eurasia in Tüyap, Istanbul. The exhibition is until Sunday 18 March, 17:30.  

Semicon China under way

Semicon China 2018

This week, xyztec is at Semicon China in cooperation with their three distributors First Technology, SST China and Raysun.

Sigma W12 at Semicon Korea

Semicon Korea 2018

Today is the first of three busy days at the Semicon Korea show. Xyztec distributor Three H is exhibiting.

Sigma stars in Audi Tech Day video

Sigma at Tech Day Quality at Audi

Audi released a series of videos on their quality assurance process at their plant in Ingolstadt. The xyztec Sigma bond tester is shown in all the videos: