How-to test bonds

Bond testing guidelines


As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. We offer how-to’s on Wire Pull (WP), Cold Bump Pull (CBP), and Tweezer Pull (TP) and access to the relevant MIL-STD-883 standards. 


Feel free to use these guides to bond testing. Please reach out if you have any comments or specific questions regarding the application or your samples.

Wire Pull

This how-to on wire pull (WP) is a guide advising what to consider and how to perform a correct wire pull test. The main focus of this manual is on wire and ribbon pulls using wire hooks. Loop height measurement is also covered. The manual briefly touches on related topics like tweezer pull and peel testing of wires, which is the subject of a separate how-to. 

Cold Bump Pull

This how-to on Cold Bump Pull (CBP) is a guide advising what to consider and how to set up a correct Cold Bump Pull (CBP) test. It generally refers to solder ball testing, but the principles apply equally to most bump testing. 

Tweezer Pull

This how-to on Tweezer Pull (TP) is a guide advising what to consider and how to perform a Tweezer Pull test or a Tweezer Peel test. Tweezer pull and peel tests usually are not challenging to do if you own the right equipment. 

The guideline on Cold Bump Pull testing, a type of tweezer testing on solder balls or bumps, is available in a separate how-to.


Herbert Stuermann

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