Wire detect functionality popular at Productronica

12 November 2015

XYZTEC team at Productronica 2015
XYZTEC team at Productronica 2015

This week, XYZTEC is exhibiting at Productronica 2015 in München, Germany. Many visitors stop by to see with their own eyes the new wire detect functionality, which is the next step forward in wire pull. The bondtester optically detects the wire and corrects for wire sweep before going on to pull the wire automatically. This ensures more repeatable positioning, consistency in your bond test results, fast test speed and high accuracy.

Visit us at Productronica 2015 A2 Booth 119
Visit us at Productronica 2015 A2 Booth 119

Friday November 13th is the last day of the Productronica 2015 in München, Germany. We invite you to come to our booth at A2 with number 119, have a look at the Condor Sigma, the Condor Sigma W12 that are there or to chat about the amazing new possibilities in the area of bond testing.

Click here to find out more about XYZTEC's Condor Sigma bond testers. The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level.


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