13 October 2014
XYZTEC has just introduced 2 new automated systems that may actually provide customers with a direct return on investment (ROI). The new Condor Sigma platform has enabled huge leaps in capability.
Bond testers are systems used to determine if a process meets a particular specification or a company’s internal bond strength requirements based on their experience. These systems have truly increased in sophistication over the past several years. Early testers were often put together by an engineer or a skilled technician... Historically bond testers were “must have tools”. They were a capital expense that customers needed to verify their processes.
Although bond testers have determined many process failures before they went to production, you could never claim that there was a return on your investment relative to reduced labor hours... there always had to be someone sitting in front of the machine!
XYZTEC has changed that scenario. Using the software automation functionality built in to the latest Sigma models, an operator will now be free to perform some other assignments while the machine automatically tests the device. The built in cameras on the Sigma and W12 systems identify fiducial marks on the device under test (DUT) by using the pattern recognition software. Essentially, the operator teaches the system to recognize one or more fiducials. The operator then teaches the system moves based on the tests required for each device. Once established, all moves in the X, Y and Z axis are carried out per the saved automation routine. When changing from unit to unit, the alignment is now performed through the camera and software based on the established fiducial(s).
To further enhance this automation capability, it is possible to perform up to 6 different test types using the Rotating Measurement Unit (RMU). The device DUT remains in the same position regardless of test type. Within a few seconds, a new tool/sensor combination resumes the automation program. Customers have found this feature very helpful when trying to automate testing of devices that may incorporate multiple wire diameters, small and large chips, ball bonds, wedge bonds, etcetera. Again... there is no need for stopping the automation. During the test change, a tool automatically moves to a safe height, then a new tool/sensor combination is rotated in place and the automation resumes.
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|Apr 2019||Free SMTconnect ticket? Register now|
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|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
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|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.