15 ИЮЛЬ 2019
Higher forces or a larger test area, this highly configurable bond tester can do it all. XYZTEC proudly announce world’s biggest bond testers which are capable to test high forces up to 1000 kgf and large test volumes with speeds up to 500 mm/s.
Minimize handling risks by testing and analysing fully automatically. Set references for fiducial marks and program comprehensive automation positions and commands from the camera. Examinig the samples using image processing, the AOI measuring toolkit and auto grading.
Meet the new Sigma L, XL and HF. Now online on our website.
The Sigma HF (High Force) an ideal test system for IGBT power modules and other high force applications for forces up to 1000 kgf and a test volume of 500 mm in X and Y combined with 200 mm in Z.
Ask us for a demonstration and learn more about the strongest bond tester on the market.
The Sigma L and XL are especially for large area applications such as automotive battery testing and high force applications that involve larger products such as battery packs and large Panel Level Packaging (PLP).
Sigma L (Large); with a working area of 500x500x200 mm
Sigma XL (Extra Large); with an extra-large working area of 500x800x200 mm
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
|ДЕК 2019||Xyztec faces any challenge|
|ИЮЛ 2019||Meet the world’s biggest bond testers|
|АПР 2019||Free SMTconnect ticket? Register now|
|АВГ 2018||Is Fully Automatic Bond Testing Possible?|
|ИЮЛ 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|МАЙ 2017||Shear testing copper pillar|
|МАР 2017||Fracture strength of thin wafers and die|
|ФЕВ 2017||Centralized database for enhanced security and SPC options|
|ЯНВ 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|ДЕК 2016||Тестирование покрытий и пленок|
|НОЯ 2016||Latest software release enables automatic grading|
|ОКТ 2016||Новые возможности в тестировании материалов|
|СЕН 2016||Тестирование изделия с крышкой на установке Condor Sigma|
|АВГ 2016||Новый нагреваемый вращающийся рабочий столик для установки Condor Sigma W12 имеет большую рабочую зону|
|ИЮЛ 2016||How to: Wire Pull|
|ИЮН 2016||Get 10% off your next tools order|
|МАЙ 2016||Pull testing bumped wafers|
|АПР 2016||SMD gull wing leads testing|
|МАР 2016||Automation: matrix bond testing made easy|
|ФЕВ 2016||Fully integrated solution for automated wafer testing|
|ЯНВ 2016||In bond testing, size does matter|
|ДЕК 2015||XYZTEC goes from strength to strength|
|НОЯ 2015||Automatic wire detect|
|ОКТ 2015||Highly reproducible stud pull tests are possible|
|СЕН 2015||What is the quality of your coatings?|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.