In the realm of bond testing, only a few suppliers exist. As veterans in the field, we understand the importance of making an informed choice when it comes..
Maximizing throughput, increase the number of tests per hour (UPH)
We have arrived at the final chapter of our journey through the game-changing improvements for Sigma bond testers. In our previous newsletters, we explored "Better Positional Precision" and..
Revolutionizing semiconductor testing: The power of automation in testing chiplets
In the fast-changing world of semiconductors, the demand for precision, efficiency, and reliability is key. Chiplets and Advanced Packaging have a revolutionary impact on chip design and manufacturing..
At Xyztec, we take pride in pushing the boundaries of bond testing technology and delivering tailored solutions to meet your unique testing needs. Our dedication to customization is..
Our agent Extripod Electronics Technology Limited is at the China Semiconductor Packaging and Test Market & Technology Annual Conference (CSPT) from October 25th to 26th, showcasing the incredible..
After COVID-19, we are finally exhibiting again, and this time with our brand new booth design! So if you have not yet managed to visit this year’s SMTconnect..
High-resolution cameras and flexible LED illumination are a must-have to achieve robust automation processes. We offer different cameras, adjustable LED illumination, and fantastic image processing options to bring..
We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers..
Fully automatic bond testing Perform complex test procedures without needing operator input. A Sigma bond testing system can automatically complete shear and pull test patterns with different orientations..
In the realm of bond testing, only a few suppliers exist. As veterans in the field, we understand the importance of making an informed choice when it comes..
Maximizing throughput, increase the number of tests per hour (UPH)
We have arrived at the final chapter of our journey through the game-changing improvements for Sigma bond testers. In our previous newsletters, we explored "Better Positional Precision" and..
Revolutionizing semiconductor testing: The power of automation in testing chiplets
In the fast-changing world of semiconductors, the demand for precision, efficiency, and reliability is key. Chiplets and Advanced Packaging have a revolutionary impact on chip design and manufacturing..
At Xyztec, we take pride in pushing the boundaries of bond testing technology and delivering tailored solutions to meet your unique testing needs. Our dedication to customization is..
Our agent Extripod Electronics Technology Limited is at the China Semiconductor Packaging and Test Market & Technology Annual Conference (CSPT) from October 25th to 26th, showcasing the incredible..
After COVID-19, we are finally exhibiting again, and this time with our brand new booth design! So if you have not yet managed to visit this year’s SMTconnect..
High-resolution cameras and flexible LED illumination are a must-have to achieve robust automation processes. We offer different cameras, adjustable LED illumination, and fantastic image processing options to bring..
We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers..
Fully automatic bond testing Perform complex test procedures without needing operator input. A Sigma bond testing system can automatically complete shear and pull test patterns with different orientations..