Visit us at SMTconnect 2022

After COVID-19, we are finally exhibiting again, and this time with our brand new booth design! So if you have not yet managed to visit this year’s SMTconnect in the […]
See the unseen

High-resolution cameras and flexible LED illumination are a must-have to achieve robust automation processes. We offer different cameras, adjustable LED illumination, and fantastic image processing options to bring out the […]
Sigma W8, Automatic wafer bond tester

We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers from 4 […]
Eliminate humar error

Fully automatic bond testing Perform complex test procedures without needing operator input. A Sigma bond testing system can automatically complete shear and pull test patterns with different orientations of bonds […]
Tool concentricity for rotating pull hooks and shear tools

Even using the best production methods for sensors and tools, tolerance buildups are unavoidable. This can create tool concentricity imperfections. Nonconcentric tools can be a problem during automatic testing or […]
Automatic grading without any assistance

Fully automatic loading and testing on a Sigma bond tester have been possible for years. However, automatic analysis without operator intervention remained a challenge. Using deep learning, we now got […]
One step forward in realizing 100% automatic bond testing

As the forerunner in automatic bond testing, xyztec comes with very promising functionalities to grade failure modes without any assistance for ball shear and wire pull tests. Read more about […]
Xyztec spreads bond testing knowledge

One of our goals as a technology leader in bond testing is “global presence and local support”. The key to this success is to spread knowledge through our annual sales […]
Presentation “What is Sigma”

Also this year, Xyztec was a participant at the yearly China Semiconductor Packaging and Test Technology & Market Conference 2018 to present the latest developments in automatic bond testing.
Is fully automatic bond testing possible?

Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is possible with a modern bond testing system.