Sigma W8, Automatic wafer bond tester
We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers from 4 […]
Continuous improvement through customer demand
70-75% of our customers are looking for custom bond testing solutions. As technology leader, we take on the frontier of bond testing from our market-leading customers. Besides focusing on developing […]
It’s all about accuracy
To provide end-users with an increasingly better product that is also reliable, bond test equipment requires accuracy in the micron range. The technology evolves, and assembly methods of bonding processes […]
Automatic grading without any assistance
Fully automatic loading and testing on a Sigma bond tester have been possible for years. However, automatic analysis without operator intervention remained a challenge. Using deep learning, we now got […]
One step forward in realizing 100% automatic bond testing
As the forerunner in automatic bond testing, xyztec comes with very promising functionalities to grade failure modes without any assistance for ball shear and wire pull tests. Read more about […]
