Xyztec unveils game-changing bond tester improvements at SMT
Are you ready for the next big thing in bond testing? Xyztec is thrilled to announce that we have game-changing improvements to our Sigma product line that will revolutionize your bond […]
Assume nano control over your shear height
Good alignment is critical for any bond test. Therefore, applying the load at precisely the correct position is essential to obtain a meaningful measurement result. For various reasons, the shear […]
How to Shear
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A shear test is one of the most common tests to perform on a […]
Self-aligning shear tool
Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components and their […]
We are excited for 2023 – how about you?
After the joyful Christmas days, the end of the year is nearby. 2022 Was a fruitful year, with once again record-breaking sales results. We have been able to pick up […]
How to Tweezer Pull?
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A Tweezer Pull (TP) or a Tweezer Peel test is easy to perform with our […]
See the unseen
High-resolution cameras and flexible LED illumination are a must-have to achieve robust automation processes. We offer different cameras, adjustable LED illumination, and fantastic image processing options to bring out the […]
Employees at number 1
We believe that employees are a company’s most important asset. This translates into many design details of our products, which is why the Sigma is the most ergonomic bond tester […]
Sigma W8, Automatic wafer bond tester
We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers from 4 […]
How to Cold Bump Pull (CBP)?
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. The Cold Bump Pull (CBP) test method is the ultimate solution for solder ball […]
