How to: Cold Bump Pull (CBP)

How to: Shear

How to: Tweezer Pull

How to: Wire Pull

Sample measurement tests


Substrate materials are the foundation of all electronics packaging.

Our systems can provide mechanical testing of any substrate of interest to ensure material performance post-assembly.Substrates represent a wide range of materials and include rigid and flexible polymers, metals, ceramics, and even wearable materials in printed electronics and advanced wearable devices. In many cases, substrate performance may be of interest. A Sigma bond tester generates mechanical bend testing on substrates and devices to measure substrate performance as a function of repeated mechanical loading over time.


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Tom Haley