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Modern electronic components enable our connected world. Mobile devices are commonplace. The global market is witnessing the growth of new “smart” and internet-of-things (IoT) capable devices for commercial and residential spaces, transportation, logistics infrastructure, energy systems, education, and more.
This technology growth continues to require mechanical testing to ensure robust device assembly at-scale for both devices and connectivity networks (i.e. 5G broadband grid, etc.) worldwide.
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
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