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Sigma bond testers meet the demanding test requirements of the semiconductor industry. A Sigma guarantees robust test capabilities on fine-pitch and small-scale packaging applications through tailored hardware and software solutions by providing micron-scale positional accuracy and best-in-class sensor resolution.
We are proud to offer dedicated test equipment solutions to support wafer-level packaging test requirements. The Sigma W12 can support wafers up to 12 inches and provide detailed wafer mapping and reliable optical solutions to support wafer-level packaging applications’ needs.
We offer various solutions to provide seamless bond testing integration with semiconductor production lines. A Sigma has full automation and SECS/GEM upstream/downstream communication capabilities. You can integrate the system into equipment front-end modules (EFEM) for semiconductor production applications to include automated part-loaders (i.e. magazine loaders).
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.