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Power management is a crucial component of electronic systems, and semiconductor power devices provide many opportunities for bond testing to gauge assembly quality.
Common test parts include MOSFETs and IGBT components. Whether these are integrated with other chips or packaged as discrete devices, xyztec’s bond testers can evaluate all bonding processes used in the production process. The Sigma HF is has a High Force platform to offer a large testable volume and configures up to 1000 kgf of testing load to support power device form factors and force requirements.
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