Home » KnowledgeCenter » Guidelines » MIL-STD-883 method 2019.9 – Die shear strength
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.
The test equipment shall consist of a load-applying instrument with an accuracy of ±5 percent of full scale or 50 grams, whichever is the greater tolerance. A circular dynamometer with a lever arm or a linear motion forceapplying instrument may be used to apply the force required for testing. The test equipment shall have the following capabilities:
The test shall be conducted, as defined herein, or to the test conditions specified in the applicable specific acquisition document consistent with the particular part construction. All die strength tests shall be counted and the specific sampling, acceptance, and added sample provisions shall be observed, as applicable.
A force sufficient to shear the die from its mounting or equal to twice the minimum specified shear strength (figure 2019-4), whichever occurs first, shall be applied to the die using the apparatus of 2 above.
Note: For passive elements only attached at the end terminations, the area used to determine the force applied shall be the total area of the mounting surface of the end terminations. An area between end terminations filled with nonadhering filler shall not be used to determine the force applied. However, any adhering material applied between the end terminations shall be used in the shear calculation. If the area between end terminations contains an adhering material, then the area of the adhering material shall be added to the area of the mounting surfaces of the end terminations and that total area shall be used to determine the force applied.
A device which fails any of the following criteria shall constitute a failure.
Note: (See examples for determining DIE AREA following figure 2019-4.)
Note: Residual element material (silicon or other) attached in discrete areas of the die attach medium shall be considered as evidenced of adhesion.
NOTE: Residual element material (silicon or other) attached in discrete areas of the die attach medium shall be considered as evidence of adhesion. For metal glass die attach, die attach material on the die and on the package base shall be considered as evidence of acceptable adhesion.
When specified, the force required to achieve separation and the category of the separation shall be recorded.
The following details shall be specified in the applicable acquisition document.
Die Area of device measuring .02 inches by .02 inches.
Die Size = .02 X .02 = .0004 IN2 = 4 X 10-4 (IN2).
Because die size is less than 5 X 10-4 (IN2) use Note 3 which states the value of minimum force required is 0.04kg/10-4 (IN2) at (1X), 0.05 kg/10-4 (IN2) at (1.25X), or 0.08 kg/10-4 (IN2) at (2X). Thus the associated minimum forces required are 0.16 kg, 0.20 kg and 0.32 kg, respectively.
Die Area of device measuring .04 inches by 0.04 inches.
Die Size = .04 X .04 = .0016 IN2 = 16 X 10-4 (IN2).
Because die size is between 5 X 10-4 (IN2) and 64 X 10-4 (IN2) use Note 2 which states the value of minimum force required is to be determined based on the chart. The values for die size 16 X 10-4 (IN2) are found on the chart by reading 16 on the (10-4 IN2) scale, then finding the coordinating force value on the (F) scale. Doing so provides minimum forces required as .64 kg at (1X), .80kg at (1.25X), and 1.28 kg at (2X).
Alternately: The chart is based on using .04kg/10-4 (IN2) at (1X), .05 kg/10-4 (IN2) at (1.25X), and .08 kg/10-4 (IN2) at (2X). Thus: the minimum forces required are 16 X .04 = .64 kg (1X), 16 X .05 = .80 kg (1.25X), and 16 X.08 = 1.28 kg (2X).
Die Area of device measuring .09 inches by .09 inches.
Die Size = .09 X .09 = .0081 IN2 = 81 X 10-4 (IN2).
Because die size is larger than 64 X 10-4 (IN2) use Note 1 which states the value of minimum force required is 2.5kg or a multiple thereof. Therefore, the minimum forces required are 2.5 kg at (1X), 3.125 kg at (1.25X), and 5.0 kg at (2X).
Learn more about die shear and see a videos of real tests.
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
Click to download thispage as PDF.
Follow us on:
© 2021 xyztec bv
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.