Home » KnowledgeCenter » Guidelines » MIL-STD-883 method 2004.7 – Lead integrity » MIL-STD-883 method 2004.7 – Test condition C1: Lead torque
This test is designed to check device leads (or terminals) and seals for their resistance to twisting motions.
The torque test requires suitable clamps and fixtures, and a torsion wrench or other suitable method of applying the specified torque without lead restriction.
The appropriate procedure of 3.1 or 3.2 for the device under test shall be used.
The device body shall be rigidly held and the specified torque shall be applied for 15 seconds minimum to the lead (terminal) to be tested, without shock, about the axis of the lead (terminal).
The device body shall be rigidly held and a torque of 1.45 ±.145 kg-mm (2.0 ±0.2 ounce-inch) unless otherwise specified, shall be applied to the lead (terminal) at a distance of 3.05 ±0.76 mm (0.12 ±0.03 inch) from the device body or at the end of the lead if it is shorter than 3.05 mm (0.12 inch). The torque shall be applied about the axis of the lead once in each direction (clockwise and counterclockwise). When devices have leads which are formed close to the body, the torque may be applied 3.05 ±0.76 mm (0.12 ±0.03 inch) from the form. For device leads which twist noticeably when less than the specified torque is applied, the twist shall be continued until the twist angle reaches 30° ±10° or the specified torque is achieved, whichever condition occurs first. The lead shall then be restored to its original position.
When examined using magnification between 10X and 20X after removal of the stress, any complete breakage (e.g. separation of the lead from the body) or loosening of the lead at the glass/ceramic seal that has caused a method 1014 seal failure shall be considered a device failure. When a seal test in accordance with method 1014 is conducted as a post test measurement following the lead integrity test(s), meniscus cracks shall not be cause for rejection of devices which pass the seal test.
The following details shall be specified in the applicable acquisition document:
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
Click to download thispage as PDF.
Follow us on:
© 2021 xyztec bv
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.