Home » KnowledgeCenter » Guidelines » MIL-STD-883 method 2004.7 – Lead integrity » MIL-STD-883 method 2004.7 – Test condition A1: Lead braze integrity
This test is for packages with brazed leads and is intended to test the lead to package attach integrity. This test applies to both flat package and dual in-line package construction.
The lead braze integrity test requires suitable clamps and fixtures for securing the device and attaching the specified weight without lead restriction. Equivalent linear pull test equipment may be used.
A tension of 0.227 kg (8 ounces), unless otherwise specified, shall be applied, without shock, to each lead or terminal to be tested in a direction perpendicular to the lead attach surface (i.e. force wants to peel lead out or off the attach medium). The force shall be maintained for 30 seconds minimum. The weight shall be applied as close to the end of the lead (terminal) as practicable.
When examined using magnification between 10X and 20X after removal of stress, any evidence of lead fracture of the solder/braze connection or disconnection of the lead from the package shall be considered a failure.
The following details shall be specified in the applicable acquisition document:
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
Follow us on:
© 2021 xyztec bv
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
Dive straight into the feedback!Login below and you can start commenting using your own user instantly