Home » KnowledgeCenter » Guidelines » MIL-STD-883 method 2004.7 – Lead integrity » MIL-STD-883 method 2004.7 – Test condition E: Lead plating integrity
This test is designed to check the lead plating of flexible and semi-flexible leads which might reasonably be expected to occur from a lead form operation.
Note: Additional plating adhesion accept/reject criteria may be flowed down by the specified plating specifications.
Attaching devices, clamps, supports, or other suitable hardware necessary to apply the bending stress through the specified bend angle.
Each flexible or semi-flexible lead to be tested shall be subjected to a 90° bend. Any number or all of the leads of the test device may be bent 90° simultaneously. Each lead shall be bent 90° in one direction in the same plane without lead restriction. Leads may be bent 90° by performing a lead form operation.
Test leads shall be bent in the normal lead form configuration.
When normally straight leads are supplied in a pre-formed condition, then this test condition shall not apply.
Flexible leads shall be bent in the middle of the lead through an arc of at least 90°, unless otherwise specified.
Semi-flexible leads shall be bent in the middle of the lead through an arc of at least 90°, unless otherwise specified.
When examined using magnification between 10X and 20X after removal of the stress, any cracking of the lead plating which results in flaking, peeling or blistering or the crack can be peeled back with a sharp instrument (i.e. knife) shall be rejected
The following details shall be specified in the applicable acquisition document:
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