Downloads

How to: Cold Bump Pull (CBP)

How to: Shear

How to: Tweezer Pull

How to: Wire Pull

Sample measurement tests

Solder ball shear

The xyztec Solder Ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress-free using the standard EZ controls. Precise shear height control and force measurement ensure accurate data with minimum distribution. Password-protected flexibility of the programmable test parameters allow you to be in control.

An optional camera system is available for visually inspecting the test result. Xyztec complies with all relevant international standards such as ASTM, MIL.

Solder-Ball-shear

How to: solder ball shear

 

Close-up solder ball shear

Standards

  • JEDEC JESD22-B117A for solder ball shear

 

Test features

  • Sensor accuracy ±0.075%
  • Shear height accuracy ±1µm
  • Fast, destructive, inline testing of lead-free BGA’s
  • Test speed from 5 mm/s to 50 mm/s

 

Failure modes

Failure in bulk material

  • Bond strength not known

Pad failure

  • Bond strength known
  • Acceptability depends on the strength

Pad crater

  • Pad strength known
  • Acceptability depends on the strength

Bond failure

  • Bond strength known
  • Acceptability depends on the strength
  • Probably weak bond

Failure in IMC

  • Bond strength known
  • Acceptability depends on the strength

Solder-ball-or-solder-bump-failure-modes

Search

Follow us on: 

© 2023 xyztec b.v.

Contact Us

Tom Haley