Stud pull #
The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested.
How to: Stud pull #
- MIL-STD-883 method 2011.9 bond strength (destructive bond pull test)
- MIL-STD-883 method 2031-1 flip-chip pull off test
- JEDEC JESD22-B109
Test features #
- High strength adhesive experience for the most challenging die pull applications
- Self aligning studs to prevent die peel
- Sensor accuracy ±0.075%
- Test at elevated temperatures up to 500°C
Highly reproducible stud pull tests are possible #
The Sigma can be provided with a micro dispenser that can dispense very small drops of glue (micro liter amounts) very accurately and is cured with UV light. Combined with a USB Tweezer and special tips that look like the inverse of a mushroom, a glass stud can be taken from a magazine fully automatically and placed with a predefined pressure on the surface with the glue.
Alternative test for thin die attach #
The stud pull test is used to test exotic applications such as bonded dies or pins pressed in FR4 boards. For die attach, the sample is clamped in a work holder and a stud is glued on the part to be tested. The stud is then pulled by a tweezer or other specially designed tooling. Depending on the stud pull application, xyztec can offer solutions from a few grams up to 500kgf. We also offer a manual tweezer that can test up to 40kgf and an optional camera system is available to record and analyze failure mode.
See also: lid pull test by mechanical grip method #
As an alternative to stud pull, xyztec developed the lid pull test by mechanical grip method. This approach eliminates the need for disposable metal block/studs and adhesives. Thus it is quicker, safer for operators and avoids clean room contamination.