Many semiconductor applications are at the ultra fine pitch and leading edge geometries. Testing these and similar devices requires precision movement in the micron scale and accurate force measurement of low forces. On the other end of the scale, a die shear test may require up to 500kgf. All these application demand precise tooling and sample manipulation for accurate application of the test load and subsequent force measurement.
The XYZTEC Condor Sigma range is designed to suit all these requirements and more.
The Condor Sigma is not only the most accurate bondtester in the world, but also the fastest. Click here to read the study that proves the Condor Sigma is up to 39% faster than the competition.
As more and more semiconductor companies are making the transition to automatic wire pull testing, the engineers are also finding out its limitations. On many products, the placement of wires is not consistent and simple automation programs will miss the wire or pull two wires at once. XYZTEC's Condor Sigma is the only bond tester in the world to overcome this problem with its automatic wire detect functionality: click here to read more.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.
Please contact us for more information, to request a demonstration or a quotation.
A wide variety of test types are relevant for this industry, among which are:
Please contact us if you have any special tweezer requirements.