Tweezer pull testing is comparable to standard pull testing. The difference between them is that special tweezers are used to clamp the part and hold it before pulling the part. Tweezer pull testing is used to perform pull tests on wires, ribbons, pins, balls or components. It is important that the part that is tested is not dislocated when the tweezer is closed.
For a standard wire pull test the hook applies the force by pulling the wire. The applied force on the wire is not equal to the force applied to the ball or wedge, because the force is not applied exactly above this ball or wedge. With a tweezer pull test it is possible to apply the force directly above the ball or wedge. The measured force will equal the applied force. Before performing this test, it may be necessary to cut the wires first. This can be done with special tips that can cut the wire. It is also possible to shear the bond on one side, straighten the wire with the tweezer and then perform the test.
XYZTEC offers the USB tweezer as a general solution for most tweezer pull tests. The tips on this tweezer can be changed and the required force to clamp a part can be set in the software. We also offer special tips to cut a wire, and we have specialized tweezers for higher forces or very small parts.
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. XYZTEC offers the best solution for this problem: the patented Contactless Cavity Cleaner.
Click here to download an article by Faulhaber, called "Mechanical stress test for component solder joints and bonding wires - Micro drives with the 'strength of a giant'" (PDF) on the USB Tweezers.
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The Condor Sigma is not only the most accurate bondtester in the world, but also the fastest. Click here to read the study that proves the Condor Sigma is up to 39% faster than the competition.
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