Tweezer pull test


How to: Tweezer Pull

We have added an extensive how-to on Tweezer Pull to our website. By doing this we aim to spread knowledge about bond testing in the industry. Click here to go to www.tweezerpull.how.


Pin pull test

Tweezer pull testing is comparable to standard pull testing. The difference between them is that special tweezers are used to clamp the part and hold it before pulling the part. Tweezer pull testing is used to perform pull tests on wires, ribbons, pins, balls or components. It is important that the part that is tested is not dislocated when the tweezer is closed.

Pin pull on FR4
Pin pull on FR4

For a standard wire pull test the hook applies the force by pulling the wire. The applied force on the wire is not equal to the force applied to the ball or wedge, because the force is not applied exactly above this ball or wedge. With a tweezer pull test it is possible to apply the force directly above the ball or wedge. The measured force will equal the applied force. Before performing this test, it may be necessary to cut the wires first. This can be done with special tips that can cut the wire. It is also possible to shear the bond on one side, straighten the wire with the tweezer and then perform the test.

XYZTEC offers the USB tweezer as a general solution for most tweezer pull tests. The tips on this tweezer can be changed and the required force to clamp a part can be set in the software. We also offer special tips to cut a wire, and we have specialized tweezers for higher forces or very small parts.



Contactless Cavity Cleaner

During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. XYZTEC offers the best solution for this problem: the patented Contactless Cavity Cleaner.


Tweezers flyer

Click here to download the Tweezer Solutions flyer (PDF) by XYZTEC.


Copper wire pull test on RFID
Copper wire pull test on RFID

Advances in tweezer pull testing

Click here to read the article that was first published in Chip Scale Review May June 2014.


Micro drives with the 'strength of a giant'

Click here to download an article by Faulhaber, called "Mechanical stress test for component solder joints and bonding wires - Micro drives with the 'strength of a giant'" (PDF) on the USB Tweezers.


Contact us

Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.


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